2024,
Burkhardt G, Blackwell SE, Chen M, Feldmann L, Björklund J, Dechantsreiter E, Bulubas L, Goerigk S, Keeser D, Falkai P, Greimel E, Bechmann P, Schulte-Körne G, Hasan A, Strube W, Padberg F
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 359-364; ISBN 9798350360400
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