2019,
Yoshida G, Imagama S, Kawabata S, Yamada K, Kanchiku T, Fujiwara Y, Tadokoro N, Takahashi M, Wada K, Yamamoto N, Ushirozako H, Kobayashi K, Yasuda A, Ando M, Tani T, Matsuyama Y
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), Hangzhou, China. IEEE: pp. 210-212; ISBN 978-1-7281-4263-0