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Zerbinati N, d'Este E, Cornaglia AI, Riva F, Farina A, Calligaro A, Gallo G, Perrotta ER, Protasoni M, Bonan P, Vojvodic A, Fioranelli M, Thuong NV, Lotti T, Tirant M, Vojvodic P
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 766-769; ISBN 978-1-7281-1639-6