The following terms were included:
EMF, "Elektromagnetisches Feld", "electromagnetic field", 電磁界
-
2016,
Djuric N, Bjelica J, Kljajic D, Milutinov M, Kasas-Lazetic K, Antic D
2016 IEEE International Conference on Emerging Technologies and Innovative Business Practices for the Transformation of Societies (EmergiTech), Balaclava, Mauritius. IEEE: pp. 50-55; ISBN 978-1-5090-0707-3
-
2016,
Yavolovskaya E, Chiqovani G, Gabriadze G, Iosava S, Svanidze L, Willmann B, Jobava R
2016 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Wroclaw, Poland. IEEE: pp. 491-196; ISBN 978-1-5090-1417-0
-
2016,
Lisewski T, Mikolajczyk A, Abramik S, Rucinski M
2016 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Wroclaw, Poland. IEEE: pp. 497-500; ISBN 978-1-5090-1417-0
-
International Telecommunication Union (ITU),
ITU-T Recommendations K-Series, K.121 (12/2016): 1-20
-
2016,
Korpinen L, Pääkkönen R, Farrugia L, Tarao H, Gobba F
2016 Progress in Electromagnetic Research Symposium (PIERS), Shanghai, China. IEEE: pp. 2106-2108; ISBN 978-1-5090-6094-8
-
2016,
Karpowicz J, Bienkowski P, Kieliszek J
2016 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Wroclaw, Poland. IEEE: pp. 668-671; ISBN 978-1-5090-1417-0
-
2016,
Koppel T, Haldre H, Shishkin A, Hussainova I, Toropovs N, Mironovs V, Tint P
2016 57th International Scientific Conference on Power and Electrical Engineering of Riga Technical University (RTUCON), Riga, Latvia. IEEE: pp. 1-6; ISBN 978-1-5090-3732-2
-
2016,
Kusuma AA, Pramana PAA, Munir BS
2016 International Conference on Smart Green Technology in Electrical and Information Systems (ICSGTEIS), Bali, Indonesia. IEEE: pp. 33-37; ISBN 978-1-5090-2691-3
-
2016,
Kundacina O, Vincan V, Antic D, Kljajic D, Kasas-Lazetic K
2016 24th Telecommunications Forum (TELFOR), Belgrade, Serbia. IEEE: pp. 1-4; ISBN 978-1-5090-4087-2
-
2016,
Karpowicz J, Kieliszek J, Sobiech J, Gryz K, Puta R
2016 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Wroclaw, Poland. IEEE: pp. 760-764; ISBN 978-1-5090-1417-0