2019,
Zerbinati N, d'Este E, Cornaglia AI, Riva F, Farina A, Calligaro A, Gallo G, Perrotta ER, Protasoni M, Bonan P, Vojvodic A, Fioranelli M, Thuong NV, Lotti T, Tirant M, Vojvodic P
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), Hangzhou, China. IEEE: 210-212; ISBN 978-1-7281-4263-0
This website uses cookies to provide you the best browsing experience. By continuing to use this website you accept our use of cookies.