The following terms were included:
electroencephalography, Elektroenzephalographie, EEG, 脳電図記録法
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2019,
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2019,
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2019,
Misselhorn J, Schwab BC, Schneider TR, Engel AK
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2019,
Li YT, Chen SC, Yang LY, Hsieh TH, Peng CW
IEEE Trans Neural Syst Rehabil Eng 27 (5): 805-813
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2019,
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2019,
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2019,
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2019,
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2019,
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Clin Neurophysiol 130 (5): 791-792
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2019,
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2019,
Jami AS, Guo X, Kulkarni P, Henin SE, Liu A, Chen Z
2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Berlin, Germany. IEEE: pp. 6430-6433; ISBN 978-1-5386-1312-2
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2019,
Qiu S, Wang S, Yi W, Zhang C, He H
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2019,
Wang N, Ming D, Ke Y, Du J, Liu W, Kong L, Zhao X, Liu S, Xu M, An X
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2019,
Chen C, Fang Y, Wang X, Bao SC, Tang Z, Tong RK
2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Berlin, Germany. IEEE: pp. 6884-6887; ISBN 978-1-5386-1312-2
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2019,
Khan A, Haueisen J, Wolters CH, Antonakakis M, Vogenauer N, Wollbrink A, Suntrup-Krueger S, Schneider TR, Herrmann CS, Nitsche M, Paulus W
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2019,
Petersen TH, Puthusserypady S
2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Berlin, Germany. IEEE: pp. 4509-4512; ISBN 978-1-5386-1312-2
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2019,
Lee H, Lee JS, Chung Y, Jung WR, Seong Kang J, Seo DW, Shon YM, Na DL, Joon Kim S
2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Berlin, Germany. IEEE: pp. 6141-6144; ISBN 978-1-5386-1312-2
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2019,
Zhou X, Liu S, Wang Y, Yin T, Yang Z, Liu Z
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2019,
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2019,
Meier J, Nolte G, Schneider TR, Engel AK, Leicht G, Mulert C
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2019,
Dai YY, Yin N, Yu H, Xu GZ
J Integr Neurosci 18 (1): 79-85
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2019,
Singh A, Trapp NT, De Corte B, Cao S, Kingyon J, Boes AD, Parker KL
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2019,
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2019,
Tremblay SA, Chapman CA, Courtemanche R
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2019,
Morales-Quezada L, El-Hagrassy MM, Costa B, McKinley RA, Lv P, Fregni F
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2019,
Morya E, Monte-Silva K, Bikson M, Esmaeilpour Z, Biazoli Jr CE, Fonseca A, Bocci T, Farzan F, Chatterjee R, Hausdorff JM, da Silva Machado DG, Brunoni AR, Mezger E, Moscaleski LA, Pegado R, Sato JR, Caetano MS, Sá KN, Tanaka C, Li LM, Baptista AF, Okano AH
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2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 166-169; ISBN 978-1-7281-1639-6
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2019,
Kim DW, Kim E, Lee C, Im CH
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2019,
Kuehne M, Schmidt K, Heinze HJ, Zaehle T
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2019,
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2019,
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2019,
Danker-Hopfe H, Dorn H, Eggert T, Sauter C
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2019,
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2019,
Ciechanski P, Kirton A, Wilson B, Williams CC, Anderson SJ, Cheng A, Lopushinsky S, Hecker KG
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2019,
Adelhöfer N, Mückschel M, Teufert B, Ziemssen T, Beste C
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2019,
Donaldson PH, Kirkovski M, Yang JS, Bekkali S, Enticott PG
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2019,
Caldwell DJ, Ojemann JG, Rao RPN
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2019,
Fertonani A, Pirulli C, Bollini A, Miniussi C, Bortoletto M
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2019,
Wagner J, Makeig S, Hoopes D, Gola M
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Saleem GT, Ewen JB, Crasta JE, Slomine BS, Cantarero GL, Suskauer SJ
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2019,
Zheng Y, Cheng J, Dong L, Ma X, Kong Q
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IBRO Rep 7: 26-33
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2019,
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2019,
Zaninotto AL, El-Hagrassy MM, Green JR, Babo M, Paglioni VM, Benute GG, Paiva WS
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2019,
Chirumamilla VC, Gonzalez-Escamilla G, Koirala N, Bonertz T, von Grotthus S, Muthuraman M, Groppa S
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2019,
Ohayon MM, Stolc V, Freund FT, Milesi C, Sullivan SS
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2019,
Danker-Hopfe H, Eggert T, Dorn H, Sauter C
Bioelectromagnetics 40 (5): 291-318
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2019,
Atefi SR, Serano P, Poulsen C, Angelone LM, Bonmassar G
IEEE Trans Electromagn Compat 61 (3): 852-859
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2019,
Oh J, Ham J, Cho D, Park JY, Kim JJ, Lee B
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