2022 IEEE 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE), Chengdu, China. IEEE: 319-322; ISBN 978-1-6654-2776-0
2022,
Kubala E, Lietz-Kijak D, Strzelecka P, Wieczorek A, Skomro P, Gronwald H
2022,
Takano M, Wada M, Zomorrodi R, Taniguchi K, Li X, Honda S, Tobari Y, Mimura Y, Nakajima S, Kitahata R, Mimura M, Daskalakis ZJ, Blumberger DM, Noda Y