The following terms were included:
Zwischenfrequenz, "intermediate frequency", 中間周波
-
2017,
Sharma A, Kesari KK, Verma HN, Sisodia R
Perspectives in Environmental Toxicology. Springer: 1-30; ISBN 978-3-319-46247-9
-
2017,
Japan Society for Occupational Health (JSOH)
J Occup Health 59 (5): 436-469
-
2017,
Campi T, Cruciani S, De Santis V, Maradei F, Feliziani M
2017 International Conference of Electrical and Electronic Technologies for Automotive, Turin, Italy. IEEE: 1-4; ISBN 978-1-5090-6006-1
-
2017,
Awasthi K, Nakabayashi T, Li L, Ohta N
ACS Omega 2 (6): 2916-2924
-
2017,
Elnail KEI, Huang X, Tan L
2017 China International Electrical and Energy Conference (CIEEC), Beijing, China. IEEE: 750-753; ISBN 978-1-5090-6277-5
-
J Drugs Dermatol 16 (5): 478-480
-
2017,
Pirard W, Vatovez B, Bernardi P
CIRED 2017 (1): 643 - 646
-
2017,
Timmons JJ, Lok E, San P, Bui K, Wong ET
Phys Med Biol 62 (21): 8264-8282
-
2017,
Liu CK, Liao WT, Chu YC, Yang CH, Chen KH, Wu CH, Lin CR
Pain Med 18 (4): 807-813
-
2017,
Cheikh M, Vassilieff Y, Fortes A, Benbouhout R, Foligné H
2017 Progress in Electromagnetics Research Symposium - Fall (PIERS - FALL), Singapore. IEEE, Singapore, Singapore: 1048-1054; ISBN 978-1-5386-1211-8
-
[Elektromagnetische Verträglichkeit in der Kfz-Technik: Beiträge der 7. GMM-Fachtagung, 2017]. VDE/VDI-Gesellschaft Mikroelektronik Mikrosystem- und Feinwerktechnik (GMM): 23-28; ISBN 978-3-8007-4460-2
-
2017,
Bärenfänger J, Cuartielles D, Kürschner D, Maarleveld M
[Elektromagnetische Verträglichkeit in der Kfz-Technik: Beiträge der 7. GMM-Fachtagung, 2017]. VDE/VDI-Gesellschaft Mikroelektronik Mikrosystem- und Feinwerktechnik (GMM): 7-16; ISBN 978-3-8007-4460-2
-
2017,
Okumura T, Iguchi E, Kojima K
2017 IEEE 6th Global Conference on Consumer Electronics (GCCE), Nagoya, Japan. IEEE; ISBN 978-1-5090-4046-9
-
2017,
Estrada J, Sinha S, Regensburger B, Afridi K, Popović Z
2017 47th European Microwave Conference (EuMC), Nuremberg, Germany. IEEE; ISBN 978-1-5386-3964-1
-
2017,
Giladi M, Munster M, Schneiderman RS, Voloshin T, Porat Y, Blat R, Zielinska-Chomej K, Hååg P, Bomzon Z, Kirson ED, Weinberg U, Viktorsson K, Lewensohn R, Palti Y
Radiat Oncol 12: 206
-
2017,
Stupp R, Taillibert S, Kanner A, Read W, Steinberg DM, Lhermitte B, Toms S, Idbaih A, Ahluwalia MS, Fink K, Di Meco F, Lieberman F, Zhu JJ, Stragliotto G, Tran DD, Brem S, Hottinger AF, Kirson ED, Lavy-Shahaf G, Weinberg U, Kim CY, Paek SH, Nicholas G, Burna J, Hirte H, Weller M, Palti Y, Hegi ME, Ram Z
JAMA 318 (23): 2306-2316
-
2017,
Lewicka M, Henrykowska G, Zawadzka M, Rutkowski M, Pacholski K, Buczyński A
Int J Occup Med Environ Health 30 (5): 695-703
-
2017,
Li J, Nie Z, Liu Y, Wang L, Hao Y
Sensors 17 (12)
-
2017,
Pavelek M, Frivaldsky M, Spanik P
2017 19th International Conference on Electrical Drives and Power Electronics (EDPE), Dubrovnik, Croatia. IEEE; ISBN 978-1-5386-3381-6
-
2017,
Kumar A, Dhillon SS, Patel S, Grube M, Noheria A
J Thorac Dis 9 Suppl 10: S1059-S1068
-
2017,
Bernabò N, Ciccarelli R, Greco L, Ordinelli A, Mattioli M, Barboni B
PLoS One 12 (12): e0187890
-
2017,
Kumari K, Koivisto H, Viluksela M, Paldanius KMA, Marttinen M, Hiltunen M, Naarala J, Tanila H, Juutilainen J
PLoS One 12 (12): e0188880
-
2017,
Yavolovskaya E, Willmann B, Gabriadze G, Chiqovani G, Sukhiashvili Z, Iosava S, Svanidze L, Jobava R
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers. IEEE, Angers, France; ISBN 978-1-5386-0689-6
-
2017 IEEE Energy Conversion Congress and Exposition (ECCE), Cincinnati, OH, USA. IEEE: 126-132; ISBN 978-1-5090-2998-3
-
2017 IEEE Energy Conversion Congress and Exposition (ECCE), Cincinnati, OH, USA. IEEE: 4022-4029; ISBN 978-1-5090-2998-3
-
2017,
Barabáš J, Janoušek L, Radil R, Moravčíková S
2017 18th International Conference on Computational Problems of Electrical Engineering (CPEE), Kutna Hora. IEEE, Kutna Hora, Czech Republic; ISBN 978-1-5386-1040-4
-
2017,
Gabriadze G, Chiqovani G, Yavolovskaya E, Svanidze L, Karkashadze D, Jobava R
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers. IEEE, Angers, France; ISBN 978-1-5386-0689-6
-
2017,
Sun W, He Y, Diao Y, Leung SW, Siu YM, Kong RYC, Lo WK
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers. IEEE, Angers, France; ISBN 978-1-5386-0689-6
-
Electromagn Biol Med 36 (4): 341-356
-
2017 40th International Conference on Telecommunications and Signal Processing (TSP), Barcelona. IEEE; ISBN 978-1-5090-3983-8
-
2017 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Jeju, Korea (South). IEEE: 2060-2063; ISBN 978-1-5090-2810-8
-
2017,
Bonmassar G, Golestanirad L
2017 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Jeju, Korea (South). IEEE: 3576-3579; ISBN 978-1-5090-2810-8
-
2017,
Haider M, Russer JA
2017 International Conference on Electromagnetics in Advanced Applications (ICEAA), Verona. IEEE, Verona, Italy: 1490-1493; ISBN 978-1-5090-4451-1
-
2017,
Zahner M, Fröhlich J, Dürrenberger G
Swiss Federal Office of Energy (SFOE),
1-57
-
2017,
Nieuwenhuijsen K, Schoutens AMC, Frings-Dresen MHW, Sluiter JK
BMC Public Health 17: 761
-
Health Phys 113 (5): 404-410
-
N Engl J Med 377 (11): 1096-1098
-
2017,
Baskar G, Ravi M, Panda JJ, Khatri A, Dev B, Santosham R, Sathiya S, Babu CS, Chauhan VS, Rayala SK, Venkatraman G
Cancer Invest 35 (6): 431-442
-
2017,
Ma C, Huang Z, Wang Z, Zhou L, Li Y
Sensors 17 (9): E2056
-
2017,
Florian MR, Zotelli VLR, de Sousa MDLR, Polloni LAB
J Acupunct Meridian Stud 10 (2): 104-108
-
2017,
Santelices IB, Friesen DE, Bell C, Hough CM, Xiao J, Kalra A, Kar P, Freedman H, Rezania V, Lewis JD, Shankar K, Tuszynski JA
Sci Rep 7: 9594
-
Chin Clin Oncol 6 (4): 41
-
2017,
Diao YL, Sun WN, He YQ, Leung SW, Siu YM
Phys Med Biol 62 (19): 7905-7922
-
2017,
Chiu CH, Lei KF, Yeh WL
Biomed Microdevices 19 (3): 69
-
2017,
Spottorno J, Gonzalez de Vega C, Buenaventura M, Hernando A
Electromagn Biol Med 36 (3): 306-314
-
2017,
Fernández-García R, Gil I
Environ Res 158: 768-772
-
2017,
Hikage T, Yamagishi M, Shindo K, Nojima T
2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Seoul, Korea (South). IEEE; ISBN 978-1-5386-3913-9
-
2017,
Sun W, He Y, Diao Y, Leung SW, Siu YM, Kong R
2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Seoul, Korea (South). IEEE; ISBN 978-1-5386-3913-9
-
2017,
Davids M, Guérin B, Malzacher M, Schad LR, Wald LL
Sci Rep 7: 5316
-
2017,
Liu R, Waheed W, Wang N, Civelekoglu O, Boya M, Chu CH, Sarioglu AF
Lab Chip 17 (15): 2650-2666