2016 International Conference on Microelectronics, Computing and Communications (MicroCom), Durgapur. IEEE: pp. 1-5; ISBN 978-1-4673-6621-2
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Belyaev I, Dean A, Eger H, Hubmann G, Jandrisovits R, Kern M, Kundi M, Moshammer H, Lercher P, Muller K, Oberfeld G, Ohnsorge P, Pelzmann P, Scheingraber C, Thill R