2020 13th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI), Chengdu, China. IEEE: pp. 619-623; ISBN 978-0-7381-0546-8
2020,
Kyun Woo M, DelaBarre L, Lee BY, Waks M, Lagore RL, Radder J, Eryaman Y, Ugurbil K, Adriany G