-
2023,
Liu S, Liu S, Gong Y, Chen J, Li H, Wu Z, Cui Z, Liu M, Lei J, Wang T
IEEE Magn Lett 14: 1-5
-
2023,
Medeiros W, Barros T, Caixeta FV
Front Hum Neurosci 17: 1164890
-
2023,
Song X, Han M, Chen Y, Yue Y
Heliyon 9 (6): e17153
-
2023,
McLaren JD, Schmaljohann H, Blasius B
Mov Ecol 11: 37
-
2023,
Uzhytchak M, Smolková B, Frtús A, Stupakov A, Lunova M, Scollo F, Hof M, Jurkiewicz P, Sullivan GJ, Dejneka A, Lunov O
Sci Rep 13: 10818
-
2023,
Milan HFM, Almazloum AA, Bassani RA, Bassani JWM
Med Biol Eng Comput 61 (10): 2637-2647
-
2023,
Skurčák L, Pavlov L, Bojda P, Gbelec J
2023 14th International Conference on Measurement, Smolenice, Slovakia. IEEE: 187-190; ISBN 9798350312188
-
2023,
Karipidis KK, Urban D, Tinker RA, Wheatley T
Public Health Res Pract 33 (1): e32122204
-
2023,
Ahmed W, Önkal D, Das R, Krishnan S, Olan F, Hardey M, Fenton A
IEEE Trans Eng Manag [in press]
-
2023,
Almalty AR, Abdelnour HM, Hawamdeh M, Alkhob SA
Risk Manag Healthc Policy 16: 1171-1185
-
2023,
Leberecht B, Wong SY, Satish B, Döge S, Hindman J, Venkatraman L, Apte S, Haase K, Musielak I, Dautaj G, Solov'yov IA, Winklhofer M, Mouritsen H, Hore PJ
Proc Natl Acad Sci USA 120 (28): e2301153120
-
2023,
England SJ, Lihou K, Robert D
Curr Biol 33 (14): 3041-3047.e4
-
2023,
Omer SA, McKnight KH, Young LI, Song S
Cell Regen 12: 21
-
2023,
Li Y, Ding J, Dong L, Sun N, Lin S
J Agric Food Chem 71 (27): 10417-10426
-
2023,
Treder M, Müller M, Fellner L, Traynor K, Rosenkranz P
Sci Total Environ 896: 165211
-
2023,
Siddiqi I, Marino M, Agrawal DK, Baron D, Connett DA, Miulli D
J Biotechnol Biomed 6 (2): 95-104
-
2023,
Sekar S, Zhang Y, Miranzadeh Mahabadi H, Buettner B, Taghibiglou C
Int J Mol Sci 24 (12): 10328
-
2023,
Ding W, Zhao X, Wang H, Wang Y, Liu Y, Gong L, Lin S, Liu C, Li Y
Int J Mol Sci 24 (12): 10271
-
2023,
Yinhui P, Hui G, Mingzhu Z, Xiaoping W, Jian S, Fangyuan Z, Yufang Z, Yajing Y
Radiat Eff Defects Solids 178 (9-10): 1135-1146
-
2023,
Wang K, Guo L, Zhang Q, Ning H, Wang S, Gong Y
2023 24th International Vacuum Electronics Conference (IVEC), Chengdu, China. IEEE: 1-2; ISBN 978-1-6654-7322-4
-
2023,
Ning H, Wang K, Zhang Q, Guo L, Wang S, Gong Y
2023 24th International Vacuum Electronics Conference (IVEC), Chengdu, China. IEEE: 1-2; ISBN 978-1-6654-7322-4
-
2023,
Cantone M, Lanza G, Fisicaro F, Bella R, Ferri R, Pennisi G, Waterstraat G, Pennisi M
Front Hum Neurosci 17: 1152204
-
2023,
Kelkar RS, Sreeraj VS, Mehta UM, Patwardhan AA, Thirthalli J, Blumberger DM
Brain Stimul 16 (3): 693-694
-
2023,
Magnuson J, Ozdemir MA, Mathieson E, Kirkman S, Passera B, Rampersad S, Dufour AB, Brooks D, Pascual-Leone A, Fried PJ, Shafi MM, Ozdemir RA
PLoS One 18 (6): e0286465
-
2023,
Steuber ER, McGuire JF
Biol Psychiatry Cogn Neurosci Neuroimaging 8 (11): 1145-1155