The following terms were included:
Nährmedium, Kulturmedium, Medium, "culture medium", 培地, 媒質
-
Contemp South Asia 25 (2): 196-211
-
2017,
Ivan L, Fernandez-Ardevol M
Societies 7 (2): 7
-
2017,
Letuta UG, Avdeeva EI
Dokl Biochem Biophys 474: 196-199
-
2017,
Kurnaz C, Yildiz D, Karagöl S
2017 18th International Symposium on Electromagnetic Fields in Mechatronics, Electrical and Electronic Engineering (ISEF) Book of Abstracts, Lodz, Poland. IEEE: pp. 1-2; ISBN 978-1-5386-1662-8
-
2017,
Ostafin M, Miernik A, Drozdz T, Nawara P, Gliniak M, Kielbasa P, Tabor S
2017 Progress in Applied Electrical Engineering (PAEE), Koscielisko, Poland. IEEE: pp. 1-5; ISBN 978-1-5386-1529-4
-
2017,
Mittal L, Raman V, Camarillo IG, Garner AL, Fairbanks AJ, Dunn GA, Sundararajan R
2017 IEEE Conference on Electrical Insulation and Dielectric Phenomenon (CEIDP), Fort Worth, TX, USA. IEEE: pp. 596-599; ISBN 978-1-5386-1195-1
-
2017,
Dong F, Liu Z, Zhang J, Fang J, Guo J, Zhang J, Fang J, Zhang Y
2017 IEEE International Conference on Plasma Science (ICOPS), Atlantic City, NJ, USA. IEEE: p. 1; ISBN 978-1-5090-5244-8
-
2017,
Kisel NN, Cheremisov VA, Kisel DV
2017 Progress In Electromagnetics Research Symposium - Spring (PIERS), St. Petersburg, Russia. IEEE: pp. 3433-3438; ISBN 978-1-5090-6270-6
-
2017,
Jovicic K, Koprivica M, Kuzle I, Neskovic N, Neskovic A
[2017 25th Telecommunication Forum (TELFOR)], Belgrade, Serbia. IEEE: pp. 1-2; ISBN 978-1-5386-3074-7
-
2017,
Psenakova Z, Benova M
2017 18th International Conference on Computational Problems of Electrical Engineering (CPEE), Kutna Hora, Czech Republic. IEEE: pp. 1-3; ISBN 978-1-5386-1040-4