The following terms were included:
Nährmedium, Kulturmedium, Medium, "culture medium", 培地, 媒質
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2024,
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2024,
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2024,
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2024,
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2024,
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2024,
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2024,
AlQhtani AZ, Al-Swedan NH, Alkhunani TA, Basalem AA, Alotaibi AM, Alsaygh KW, AlSahabi AM, Alabdulkarim AO
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2024,
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IEEE Trans Eng Manag 71: 13327-13344
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2024,
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2023,
Ijjeh A, Mifdal S, Cueille M, Dubard JL, Ney M
2023 17th European Conference on Antennas and Propagation (EuCAP), Florence, Italy. IEEE: pp. 1-5; ISBN 978-1-6654-7541-9
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2023,
Frith J, Campbell S, Komen L
Mobile Media & Communication 11 (2): 174-192
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2023,
Ziane M, Boriskin A, Zhadobov M
IEEE Antennas Wirel Propag Lett 22 (10): 2347-2351
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2023,
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2023,
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2023,
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2023,
Kaur S, Kaur J, Khanna R
2023 International Conference on Modeling, Simulation & Intelligent Computing (MoSICom), Dubai, United Arab Emirates. IEEE: pp. 679-682; ISBN 9798350393422
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2023,
Showrov SS, Ahmed M, Hossain N, Shuvo MRA, Das T, Asad-Uz-Zaman
2023 International Conference on Information and Communication Technology for Sustainable Development (ICICT4SD), Dhaka, Bangladesh. IEEE: pp. 295-299; ISBN 9798350358674
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2023,
Lodi MB, Curreli N, Fanti A, Mazzarella G
2023 IEEE Nanotechnology Materials and Devices Conference (NMDC), Paestum, Italy. IEEE: pp. 395-400; ISBN 9798350335477
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2023,
Xie G, Fang M, Huang Z, Wu X, Ren X, Feng N
IEEE Trans Microw Theory Tech 71 (3): 1009-1018
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2023,
Wilhelmy S, Simond SH, Grözinger M
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2023,
Hosur S, Karan SK, Priya S, Kiani M
2023 IEEE Biomedical Circuits and Systems Conference (BioCAS), Toronto, ON, Canada. IEEE: pp. 1-5; ISBN 9798350300277
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2023,
Dalyot K, Baram-Tsabari A
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2023,
Wang L, Li S, Li T, Zheng W, Li Y, Xu G
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2023,
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2023 Light Conference, Changchun, China. IEEE: pp. 1-5; ISBN 9798350327175
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2023,
Yang HN, Liang Y, Han DW, Liu L, Xie JF, Tian SM, Xia CD, Wei Y
Chin J Burns Wounds 39 (12): 1180-1184
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2023,
Noetscher GM, Serano PJ, Horner M, Prokop A, Hanson J, Fujimoto K, Brown J, Nazarian A, Ackerman J, Makaroff SN
eLife 12: RP90440
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2023,
Chang CW, Lee CC, Liao JC
BMC Musculoskelet Disord 24: 943
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2023,
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Radiologie 63 Suppl 2: 34-40
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2023,
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2023,
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2023,
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2023,
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Appl Sci 13 (19): 10621
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2023,
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2023 IEEE Canadian Conference on Electrical and Computer Engineering (CCECE), Regina, SK, Canada. IEEE: pp. 94-98; ISBN 9798350323986
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2023,
Soleimani G, Kupliki R, Paulus M, Ekhtiari H
PLoS Comput Biol 19 (10): e1011572
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GSM Association (GSMA), Mobile & Wireless Forum (MWF),
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2023,
Gross D, Scandling B, Leewood AR, Simonetti OP
Biomed Phys Eng Express 9 (6): 065025
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2023,
Orlacchio R, Kolosnjaj-Tabi J, Mattei N, Lévêque P, Rols MP, Arnaud-Cormos D, Golzio M
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2023,
Walter J, Hader M, Sengedorj A, Fietkau R, Frey B, Gaipl US
Int J Hyperthermia 40 (1): 2265590
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2023,
Subedi TR, Perez-Garcia JM, Gurung S, Baral HS, Bhattacharjee A, Anadon JD, Virani MZ, Thomsett S, Buij R
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2023,
Douglas M, Jain N, Kochali B, Kuster N
2023 XXXVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS), Sapporo, Japan. IEEE: pp. 1-3; ISBN 9798350309973
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2023,
Fraga Rivas P, de Miguel Criado J, García del Salto Lorente L, Gutiérrez Velasco L, Quintana Valcarcel P
Radiologia 65 (5): 447-457
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Zhongguo Yi Liao Qi Xie Za Zhi 47 (5): 497-501
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2023,
Ramzan M, Khaleghi A, Fang X, Wang Q, Neumann N, Plettemeier D
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2023,
Reddy IVAK, Elmaadawy S, Furlani EP, Jornet JM
Sci Rep 13: 14643
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Bioelectrochemistry 154: 108554
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2023,
Noetscher GM, Serano PJ, Horner M, Prokop A, Hanson J, Fujimoto K, Brown JE, Nazarian A, Ackerman J, Makaroff SN
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2023,
Kataja J, Nissi J, Roine T, Laakso I
IEEE Trans Electromagn Compat 65 (6): 1647-1655
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2023,
Yin Y, Xu X, Li D, Yao B, Wang H, Zhao L, Wang H, Dong J, Zhang J, Peng R
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