The following terms were included:
Kurzwelle, "high frequency", "short wave", 高周波, 短波
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Huang Y, Li C, Cai R, Lin T, Chen W
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IEEE Microw Mag 26 (1): 13-15
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Kashyap ND, Bhattacharjee U, Das S, Kishore NK, Mahadevappa M
2024 IEEE 21st India Council International Conference (INDICON), Kharagpur, India. IEEE: pp. 1-6; ISBN 9798350391299
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2024,
Deaconescu DB, Petrita T, Miclaus S
2024 Advanced Topics on Measurement and Simulation (ATOMS), Constanta, Romania. IEEE: pp. 7-10; ISBN 9798350358384
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Judice A, Malhotra S, Sharma M
2024 4th International Conference on Advancement in Electronics & Communication Engineering (AECE), GHAZIABAD, India. IEEE: pp. 452-456; ISBN 9798350364736
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Elmaadawy S, Jornet JM
GLOBECOM 2024 - 2024 IEEE Global Communications Conference, Cape Town, South Africa. IEEE: pp. 4866-4871; ISBN 9798350351262
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2024,
Marturano F, Gomez-Cid L, Straney D, Yin-Ching Chen I, Albrecht AMC, Yu X, Ay I, Bonmassar G
2024 46th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Orlando, FL, USA. IEEE: pp. 1-4; ISBN 9798350371505
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2024 IEEE Asia-Pacific Conference on Applied Electromagnetics (APACE), Langkawi, Kedah, Malaysia. IEEE: pp. 25-28; ISBN 9798350364170
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2024,
Jeladze V, Ribas FO, Nozadze T, Partsvania B, de Borre E, Thielens A
2024 IEEE Asia-Pacific Microwave Conference (APMC), Bali, Indonesia. IEEE: pp. 1215-1217; ISBN 9798350363555
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2024,
Lee AK, Hong SE, Moon JI
2024 IEEE Asia-Pacific Microwave Conference (APMC), Bali, Indonesia. IEEE: pp. 787-789; ISBN 9798350363555
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2024,
Competence Centre Electromagnetic Fields (KEMF)
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2024,
Meyer V, Gronau AI, Drees K, Jyoti J, Cakir E, Hütt MT, Lerchl A
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2024,
Ahmad NE, Rosdi M, Isa RM
2024 IEEE 12th Conference on Systems, Process & Control (ICSPC), Malacca, Malaysia. IEEE: pp. 160-165; ISBN 9798350391404
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2024,
Tan X, Guo A, Tian J, Li Y, Shi J
Front Neurosci 18: 1500619
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2024 11th International Symposium on Telecommunications (IST), Tehran, Iran, Islamic Republic of. IEEE: pp. 283-286; ISBN 9798350356267
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2024 IEEE XXXI International Conference on Electronics, Electrical Engineering and Computing (INTERCON), Lima, Peru. IEEE: pp. 1-8; ISBN 9798350378351
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2024,
Xu J, Ding Y, Liu B, Wu X, Yang X, Liu Y, Deng H
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2024,
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2024,
Wu X, Zhang B, Ambler G, Chen Q, Huang H, Lin H, Fang S, Liu N, Du H
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AppliedMath 4 (4): 1358-1381
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2024,
Ozer U, Yucens B, Tumkaya S
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2024,
Lybbert C, Webb T, Wilson MG, Tsunoda K, Kubanek J
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