2020 13th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI), Chengdu, China. IEEE: pp. 619-623; ISBN 978-0-7381-0546-8
2020,
Suri S, Dehghan SF, Sahlabadi AS, Ardakani SK, Moradi N, Rahmati M, Tehrani FR
2020,
Migault L, Garlantézec R, Piel C, Marchand-Martin L, Orazio S, Cheminat M, Zaros C, Carles C, Cardis E, Ancel PY, Charles MA, de Seze R, Baldi I, Bouvier G