-
2014,
Lucke L, Bluvshtein V
2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Chicago, IL, USA. IEEE: pp. 286-289; ISBN 978-1-4244-7929-0
-
2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Chicago, IL, USA. IEEE: pp. 6549-6552; ISBN 978-1-4244-7929-0
-
2014,
Lv B, Su C, Yang L, Xie Y, Wu T
2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Chicago, IL, USA. IEEE: pp. 986-989; ISBN 978-1-4244-7929-0
-
2014,
Laakso I, Hirata A, Fujiwara O
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: pp. 202-205; ISBN 978-4-88552-287-1
-
2014,
Sunohara T, Laakso I, Hirata A, Onishi T
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: pp. 449-452; ISBN 978-4-88552-287-1
-
2014,
Nagaoka T, Watanabe S, Niwa T
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: pp. 190-193; ISBN 978-4-88552-287-1
-
2014,
Sasaki K, Nagaoka T, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: pp. 537-540; ISBN 978-4-88552-287-1
-
2014,
Kim M, Kim S, Ahn S, Chun Y, Park S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: pp. 426-429; ISBN 978-4-88552-287-1
-
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: pp. 194-197; ISBN 978-4-88552-287-1
-
2014,
Higashiyama J, Tarusawa Y
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: pp. 650-653; ISBN 978-4-88552-287-1