2020 13th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI), Chengdu, China. IEEE: pp. 619-623; ISBN 978-0-7381-0546-8
2020,
Colombini A, Perucca Orfei C, Vincenzi F, De Luca P, Ragni E, Viganò M, Setti S, Varani K, de Girolamo L