The following terms were included:
電磁両立性, "elektromagnetische Verträglichkeit", EMC, EMV, "electromagnetic compatibility"
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2016,
Endo Y, Saito K, Watanabe S, Takahashi M, Ito K
IEEE Trans Electromagn Compat 58 (1): 30-39
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IEEE Trans Electromagn Compat 58 (1): 40-46
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2016,
Andersen JB, Nielsen JO, Pedersen GF
IEEE Trans Electromagn Compat 58 (1): 47-53
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2016,
Korovkin N, Diop CY
2016 IEEE NW Russia Young Researchers in Electrical and Electronic Engineering Conference (EIConRusNW), St. Petersburg, Russia. IEEE: pp. 604-607; ISBN 978-1-5090-0445-4
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2016,
Barnes F, Greenenbaum B
IEEE Power Electronics Magazine 3 (1): 60-68
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2016,
Senic D, Sarolic A, Joskiewicz ZM, Holloway CL
IEEE Trans Electromagn Compat 58 (3): 721-728
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2016,
Mattei E, Lucano E, Censi F, Triventi M, Calcagnini G
IEEE Trans Electromagn Compat 58 (1): 314-322
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2016,
Ishida K, Fujioka T, Endo T, Hosokawa R, Fujisaki T, Yoshino R, Hirose M
J Med Syst 40 (3): 46
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IEEE Trans Electromagn Compat: 189-195
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2015,
Jog SR, Paranjape PM
2015 International Conference on Energy Systems and Applications, Pune, India. IEEE: pp. 706-711; ISBN 978-1-4673-6817-9
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2015,
Nagaoka T, Niwa T, Watanabe S
2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), Taipei, Taiwan. IEEE: pp. 444-447; ISBN 978-1-4799-6668-4
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2015,
Pavlik M, Lisoň L, Kurimský P
Kolcun M, Kurimský J, Kolcunová I (eds.): 8th International Scientific Symposium on Electrical Power Engineering (ELEKTROENERGETIKA 2015). Curran Associates, Inc., Red Hook, NY; pp. 560-563; ISBN 978-1-5108-1142-3
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2015,
Periyasamy M, Dhanasekaran R
J Microw Power Electromagn Energy 49 (3): 160-170
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2015,
Kim H, Song C, Kim D-H, Kim J
2015 IEEE International Symposium on Electromagnetic Compatibility (EMC), Dresden, Germany. IEEE: pp. 1369-1374; ISBN 978-1-4799-6615-8
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2015,
Cruciani S, Campi T, Feliziani M, Maradei F
2015 IEEE International Symposium on Electromagnetic Compatibility (EMC), Dresden, Germany. IEEE: pp. 720-725; ISBN 978-1-4799-6615-8
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2015,
Ishida T, Nitta S, Xiao F, Kami Y, Fujiwara O
2015 IEEE International Symposium on Electromagnetic Compatibility (EMC), Dresden, Germany. IEEE: pp. 839-842; ISBN 978-1-4799-6615-8
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2015,
Bohmelt S, Scharf F, Dudzinski M, Rozgic M, Fichte LO, Stiemer M
2015 IEEE International Symposium on Electromagnetic Compatibility (EMC), Dresden, Germany. IEEE: pp. 535-540; ISBN 978-1-4799-6615-8
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2015 IEEE International Symposium on Electromagnetic Compatibility (EMC), Dresden, Germany. IEEE: pp. 702-707; ISBN 978-1-4799-6615-8
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2015,
Armstrong R, Dawson L, Rowell AJ, Marshman CA, Ruddle AR
2015 IEEE International Symposium on Electromagnetic Compatibility (EMC), Dresden, Germany. IEEE: pp. 662-667; ISBN 978-1-4799-6615-8
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2015,
Kamimura Y, Sato Y, Yamashita A, Nagaoka T, Wake K
2015 IEEE International Symposium on Electromagnetic Compatibility (EMC), Dresden, Germany. IEEE: pp. 1416-1419; ISBN 978-1-4799-6615-8
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2015,
Kim BC, Kim S-M, Moon J-I, Kwon J-H, Cho I-K
2015 IEEE Global Electromagnetic Compatibility Conference (GEMCCON), Adelaide, SA, Australia. IEEE: pp. 1-3; ISBN 978-1-4673-8548-0
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2015,
Istanbullu OB, Akdogan G
[2015 Medical Technologies National Conference (TIPTEKNO)], Bodrum, Turkey. IEEE: pp. 1-4; ISBN 978-1-4673-7765-2
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2015,
Lee AK, Hong SE, Kwon JH, Choi HD
IEEE Trans Electromagn Compat 57 (5): 1281-1284
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Journal of the Chinese Institute of Engineers 38 (6): 760-769
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2015,
Frikha A, Bensetti M, Pichon L, Lafon F, Duval F, Benjelloun N
IEEE Trans Electromagn Compat 57 (6): 1481-1490
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2015,
Apreutesei AL, Curteza A, Baltag O
2015 9th International Symposium on Advanced Topics in Electrical Engineering (ATEE), Bucharest, Romania. IEEE: pp. 352-355; ISBN 978-1-4799-7514-3
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2015,
Costea M, Baran I, Leonida T
2015 9th International Symposium on Advanced Topics in Electrical Engineering (ATEE), Bucharest, Romania. IEEE: pp. 331-336; ISBN 978-1-4799-7514-3
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2015,
Seckler T, Jagielski K, Stunder D
Int J Environ Res Public Health 12 (6): 5886-5904
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2015,
Chakarothai J, Shi J, Wang J, Fujiwara O, Wake K, Watanabe S
IEEE Electromagn Compat Mag 4 (1): 57-66
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2015,
Lee WS, Oh KS, Yu JW
IEEE Antennas Wirel Propag Lett 14: 1459-1462
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2015,
Vassilev A, Ferber A, Wehrmann C, Pinaud O, Schilling M, Ruddle AR
IEEE Trans Electromagn Compat 57 (6): 35-43
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2015,
Ardavan M, Trueman CW, Schmitt KA
IEEE Trans Electromagn Compat 57 (6): 69-79
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2015,
Bamba A, Gaillot DP, Tanghe E, Vermeeren G, Joseph W, Lienard M, Martens L
IEEE Trans Electromagn Compat 57 (6): 27-34
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2014,
Carsimamovic A, Mujezinovic A, Carsimamovic S, Muharemovic A, Bajramovic Z
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: pp. 611-614; ISBN 978-1-4799-3226-9
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2014,
Laissaoui AM, Nekhoul B, Poljak D, Kerroum K, Drissi KE
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: pp. 974-979; ISBN 978-1-4799-3226-9
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2014,
Yngve Hamnerius, Tomas Nilsson
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: pp. 364-368; ISBN 978-1-4799-3226-9
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2014,
Döbbelin R, Förster S, Lindemann A
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: pp. 369-374; ISBN 978-1-4799-3226-9
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2014,
Lisewski T, Luszcz J
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: pp. 360-363; ISBN 978-1-4799-3226-9
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2014,
Kavya M, Yashodhara B, Arunachalam V, Devendranath D, Yellaiah A, Rashmi, Sailaja RRN
2014 International Conference on Power Signals Control and Computations (EPSCICON), Thrissur, India. IEEE: pp. 1-6
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2014,
Ptitsyna NG, Ponzetto A, Kopytenko YA, Ismagilov VS, Korobeinikov AG
J Sci Res Rep 3 (13): 1753 - 1770
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2014,
Theodoridis MP, Mollov SV
Biomed Tech 59 (5): 461-469
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2014,
Marshman CA, Armstrong R, Dawson L, Rowell AJ, Ruddle AR
5th IET Hybrid and Electric Vehicles Conference (HEVC 2014), London, UK. IET: p. 14737980; ISBN 978-1-84919-911-7
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2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: pp. 354-359; ISBN 978-1-4799-3226-9
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2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: pp. 348-353; ISBN 978-1-4799-3226-9
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2014,
Haridim M, Levin B, Revich S, Chulski S, Sauleau R, Zemach R
IEEE Electromagn Compat Mag 3 (4): 43-48
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2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: pp. 745-748; ISBN 978-4-88552-287-1
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2014,
Diao YL, Sun WN, Chan KH, Leung SW, Siu YM
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: pp. 226-229; ISBN 978-4-88552-287-1
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2014,
Laakso I, Hirata A, Fujiwara O
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: pp. 202-205; ISBN 978-4-88552-287-1
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2014,
Sunohara T, Laakso I, Hirata A, Onishi T
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: pp. 449-452; ISBN 978-4-88552-287-1
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2014,
Nagaoka T, Watanabe S, Niwa T
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: pp. 190-193; ISBN 978-4-88552-287-1