The following terms were included:
電磁両立性, "elektromagnetische Verträglichkeit", EMC, EMV, "electromagnetic compatibility"
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2021,
Matsuzawa S-i, Kojima T, Mizuno K, Kagawa K, Wakamatsu A
IEEE Trans Electromagn Compat 63 (6): 1896-1903
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2021,
Campi T, Cruciani S, Maradei F, Feliziani M
IEEE Trans Electromagn Compat 63 (5): 1726-1734
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2021,
Shiina T, Kudo T, Herai D, Kuranari Y, Sekiba Y, Yamazaki K
IEEE Trans Electromagn Compat 63 (6): 1812-1819
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IEEE Trans Electromagn Compat 63 (5): 1690-1698
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2021,
Lottner T, Reiss S, Bitzer A, Bock M, Özen AC
IEEE Trans Electromagn Compat 63 (3): 662-672
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2021,
Wang Y, Zheng J, Wang Q, Chen J, Kainz W
IEEE Trans Electromagn Compat 63 (3): 673-680
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2021,
Shah IA, Cho Y, Yoo H
IEEE Trans Electromagn Compat 63 (3): 681-691
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2021,
Gifuni A, Grassini G, Buono A, Festa D, Flintoft ID, Gargiulo S, Nunziata F, Migliaccio M
IEEE Trans Electromagn Compat 63 (2): 427-434
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2021,
Hakuta Y, Watanabe T, Takenaka T, Ito T, Hirata A
IEEE Trans Electromagn Compat 63 (1): 313-318
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2020,
Zhang J, Yan S, Hu X, Vandenbosch GAE
IEEE Trans Electromagn Compat 62 (4): 1045-1054
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2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: pp. 1-6; ISBN 978-1-7281-5580-7
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2020,
Ragazzo H, Prost D, Bobo JF, Faure S
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: pp. 1-6; ISBN 978-1-7281-5580-7
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2020,
Pei Y, Pichon L, Bensetti M, Le-Bihan Y
PHYS 18 (1): 391-396
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2020,
Giaccone L, Cirimele V, Canova A
IEEE Trans Electromagn Compat 62 (1): 83-92
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2020,
Zheng J, Wang Z, Wang Q, Hu S, Gu Z, Kainz W, Chen J
IEEE Trans Electromagn Compat 62 (6): 2689-2695
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2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: pp. 1-5; ISBN 978-1-7281-5580-7
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2020,
Ghnimi S, Gharsallah A
J Electr Syst 16 (1): 134-145
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2020,
Das M, Jeunink S, Vogt-Ardatjew R, Van den Berg B, Leferink F
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: pp. 1-6; ISBN 978-1-7281-5580-7
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2020,
Ishida K, Wu I, Gototh K, Matsumoto Y
J Med Syst 44 (9): 154
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2020,
Wang S, Xie Y, Shang S, Hao X, Lu X
2020 6th Global Electromagnetic Compatibility Conference (GEMCCON), XI'AN, China. IEEE: pp. 1-5; ISBN 978-1-7281-8464-7
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2020,
Zhang W, Song G, Zhao Q, Qi X
2020 6th Global Electromagnetic Compatibility Conference (GEMCCON), XI'AN, China. IEEE: pp. 1-4; ISBN 978-1-7281-8464-7
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2020,
Bejenaru O, Lazarescu C, Ursachianu MV, Salceanu A
2020 International Conference and Exposition on Electrical And Power Engineering (EPE), Iasi, Romania. IEEE: pp. 322-326; ISBN 978-1-7281-8127-1
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2020,
Balawender K, Orkisz S
Cent European J Urol 73 (4): 563-568
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2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: pp. 1-5; ISBN 978-1-7281-5580-7
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2020,
Dergham I, Martinez Rocha JC, Imad R, Alayli Y
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: pp. 1-5; ISBN 978-1-7281-5580-7
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2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: pp. 1-4; ISBN 978-1-7281-5580-7
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2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: pp. 1-6; ISBN 978-1-7281-5580-7
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2020,
Ramos V, Trillo AM, Suarez OJ, Suarez S, Febles VM, Rabassa LE, Karpowicz J, Fernandez de Aldecoa JC, Hernandez JA
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: pp. 1-5; ISBN 978-1-7281-5580-7
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2020,
Simonazzi M, Sandrolini L, Reggiani U
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: pp. 1-5; ISBN 978-1-7281-5580-7
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2020,
Song X, Yue Y, Zhu X, Chang H
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: pp. 1-4; ISBN 978-1-7281-5580-7
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2020,
Bonato M, Dossi L, Chiaramello E, Fiocchi S, Gallucci S, Tognola G, Ravazzani P, Parazzini M
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: pp. 1-4; ISBN 978-1-7281-5580-7
-
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: pp. 1-4; ISBN 978-1-7281-5580-7
-
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: pp. 1-4; ISBN 978-1-7281-5580-7
-
2020,
Miwa K, Takenaka T, Hirata A
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: pp. 1-4; ISBN 978-1-7281-5580-7
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2020,
Onishi T, Niskala K, Christ A, Roman J
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: pp. 1-4; ISBN 978-1-7281-5580-7
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2020,
Gravina A, Moglie F, Bastianelli L, Mariani Primiani V
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: pp. 1-6; ISBN 978-1-7281-5580-7
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2020,
Cruciani S, Campi T, Maradei F, Feliziani M
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: pp. 1-4; ISBN 978-1-7281-5580-7
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2020,
Kamimura Y, Daimon K, Matsumoto N, Kimura S, Sato K
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: pp. 1-4; ISBN 978-1-7281-5580-7
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2020,
Di Francesco A, De Santis V
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: pp. 1-5; ISBN 978-1-7281-5580-7
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2020,
Lämmle T, Parspour N, Mönch M
2020 5th International Conference on Smart and Sustainable Technologies (SpliTech), Split, Croatia. IEEE: pp. 1-6; ISBN 978-1-7281-7363-4
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2020,
Asadi R, Aliakbarian H, Khayambashi G, Majdolashrafi P
IEEE Electromagn Compat Mag 9 (3): 45-54
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2020,
Dinarević EC, Poljak D, Blažević Z
2020 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: pp. 1-4; ISBN 978-1-7281-7538-6
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IEEE Electromagn Compat Mag 9 (3): 96-99
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2020,
Xia M, Zheng J, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: pp. 257-260; ISBN 978-1-7281-7431-0
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2020,
Fiedler TM, Ladd ME, Clemens M, Bitz AK
IEEE Letters on Electromagnetic Compatibility Practice and Applications 2 (3): 85-91
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2020,
Lan Q, Zheng J, Chen J, Zhang M
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: pp. 270-275; ISBN 978-1-7281-7431-0
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2020,
Hong S, Jeong S, Lee S, Sim B, Kim H, Kim J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: pp. 623-625; ISBN 978-1-7281-7431-0
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2020,
Yang R, Zheng J, Song S, Guo R, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: pp. 261-265; ISBN 978-1-7281-7431-0
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2020,
Yang X, Zheng J, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: pp. 266-269; ISBN 978-1-7281-7431-0
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2020,
Rumeng T, Ying S, Tong W, Wentao Z
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: pp. 659-662; ISBN 978-1-7281-7431-0