The following terms were included:
米国電気電子学会, "Institute of Electrical and Electronics Engineers", IEEE
-
2023,
Son Y, Chen ZC, Roh H, Lee BC, Im M
IEEE Trans Neural Syst Rehabil Eng 31: 3803-3812
-
2023,
Mahfuz MMH, Islam MR, Habaebi MH, Malek NA, Sami MW
2023 9th International Conference on Computer and Communication Engineering (ICCCE), Kuala Lumpur, Malaysia. IEEE: pp. 394-399; ISBN 9798350325225
-
2023,
Parsa N, Sanphuang V
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: p. 655; ISBN 9798350309775
-
2023,
Zaki AZA, Hamad EKI, Abouelnaga TG, Elsadek HA, Khaleel SA, Al-Gburi AJA, Zakaria Z
Bioengineering 10 (2): 216
-
2023,
Shib B, Yeasar SMS, Hassan M, Islam R, Islam AKME
2023 International Conference on Communications, Computing and Artificial Intelligence (CCCAI), Shanghai, China. IEEE: pp. 12-16; ISBN 9798350311303
-
2023,
Khan A, Mishra A, Dubey SK, Singh AK
2023 IEEE Wireless Antenna and Microwave Symposium (WAMS), Ahmedabad, India. IEEE: pp. 1-4; ISBN 9798350312447
-
2023,
Iqbal A, Al-Hasan M, Ben Mabrouk I, Denidni TA
IEEE Trans Antennas Propag 71 (11): 8592-8601
-
2023,
Chauhan S, Asok AO, Tripathi A, Dey S
2023 IEEE Wireless Antenna and Microwave Symposium (WAMS), Ahmedabad, India. IEEE: pp. 1-4; ISBN 9798350312447
-
2023,
Chauhan S, Asok AO, Tripathi A, Dey S
2023 IEEE Wireless Antenna and Microwave Symposium (WAMS), Ahmedabad, India. IEEE: pp. 1-4; ISBN 9798350312447
-
2023,
Boukabou I, Rupanetti D, Kaabouch N, Foust L
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: pp. 413-418; ISBN 9798350309775