The following terms were included:
皮下の, subkutan, s.c., subcutaneous
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2016,
Papathanasopoulos P, Preka-Papadema P, Gkotsinas A, Dimisianos N, Hillaris A, Katsavrias C, Antonakopoulos G, Moussas X, Andreadou E, Georgiou V, Papachristou P, Kargiotis O
Clin Neurol Neurosurg 146: 82-89
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2016,
Thaijiam C, Woradit K, Leela N, Kaewwibool P
2016 9th Biomedical Engineering International Conference (BMEiCON), Laung Prabang, Laos. IEEE; ISBN 978-1-5090-3940-1
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2016,
Klein J, Sandi-Gahun S, Schackert G, Juratli TA
Cephalalgia 36 (5): 445-453
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2016,
Wenger C, Bomzon Z, Salvador R, Basser PJ, Miranda PC
2016 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Orlando, FL, USA. IEEE: pp. 5664-5667; ISBN 978-1-4577-0220-4
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2016,
Miranda PC, Salvador R, Wenger C, Fernandes SR
2016 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Orlando, FL, USA. IEEE: pp. 6457-6460; ISBN 978-1-4577-0220-4
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2016,
Powell ES, Carrico C, Westgate PM, Chelette KC, Nichols L, Reddy L, Salyers E, Ward A, Sawaki L
NeuroRehabilitation 39 (3): 439-449
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2016,
Denzi A, Merla C, Casciola M, Hwang JC, Cheng X, Apollonio F, Liberti M
2016 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Orlando, FL, USA. IEEE: pp. 4232-4235; ISBN 978-1-4577-0220-4
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2016,
Bastos R, Fernandes SR, Salvador R, Wenger C, de Carvalho MA, Miranda PC
2016 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Orlando, FL, USA. IEEE: pp. 1754-1757; ISBN 978-1-4577-0220-4
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2016,
Datta A, Krause MR, Pilly PK, Choe J, Zanos TP, Thomas C, Pack CC
2016 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Orlando, FL, USA. IEEE: pp. 1774-1777; ISBN 978-1-4577-0220-4
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2016,
Santos L, Martinho M, Salvador R, Wenger C, Fernandes SR, Ripolles O, Ruffini G, Miranda PC
2016 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Orlando, FL, USA. IEEE: pp. 1778-1781; ISBN 978-1-4577-0220-4