The following terms were included:
比吸収率, "Spezifische Absorptionsrate", SAR, "specific energy absorption rate", "specific absorption rate", 比エネルギー吸収率
-
2019,
Mao C, Werner PL, Werner DH, Vital D, Bhardwaj S
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: 1555-1556; ISBN 978-1-7281-0693-9
-
2019,
Gao G, Zhang R, Yang C, Meng H, Geng W, Hu B
IET Microwaves, Antennas & Propagation 13 (13): 2319 - 2323
-
2019,
Ebadi-Shahrivar A, Fay P, Hochwald BM, Love DJ
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: 1005-1006; ISBN 978-1-7281-0693-9
-
2019,
Lan Q, Zheng J, Chen J
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: 1861-1862; ISBN 978-1-7281-0693-9
-
2019,
Phaneuf M, Mojabi P
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: 533-534; ISBN 978-1-7281-0693-9
-
2019,
Song S, Zheng J, Chen J
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: 1009-1010; ISBN 978-1-7281-0693-9
-
2019,
Shiina T, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 744-747; ISBN 978-1-7281-1639-6
-
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 691-694; ISBN 978-1-7281-1639-6
-
2019,
Ahmed S, Mehmood A, Sydänheimo L, Ukkonen L, Björninen T
2019 IEEE International Conference on RFID Technology and Applications (RFID-TA), Pisa, Italy. IEEE: 231-235; ISBN 978-1-7281-0590-1
-
2019,
Andrenko AS, Shimizu Y, Wake K
2019 IEEE International Conference on RFID Technology and Applications (RFID-TA), Pisa, Italy. IEEE: 297-300; ISBN 978-1-7281-0590-1