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2014,
Lucke L, Bluvshtein V
2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Chicago, IL, USA. IEEE: pp. 286-289; ISBN 978-1-4244-7929-0
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2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Chicago, IL, USA. IEEE: pp. 6549-6552; ISBN 978-1-4244-7929-0
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2014,
Lv B, Su C, Yang L, Xie Y, Wu T
2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Chicago, IL, USA. IEEE: pp. 986-989; ISBN 978-1-4244-7929-0
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2014,
Laakso I, Hirata A, Fujiwara O
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 202-205; ISBN 978-4-88552-287-1
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2014,
Sunohara T, Laakso I, Hirata A, Onishi T
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 449-452; ISBN 978-4-88552-287-1
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2014,
Kim M, Kim S, Ahn S, Chun Y, Park S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 426-429; ISBN 978-4-88552-287-1
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2014,
Shiina T, Suzuki Y, Kasai Y, Inami Y, Taki M, Wake K
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 166-169; ISBN 978-4-88552-287-1
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2014,
Chakarothai J, Suzuki Y, Taki M, Kojima M, Sasaki K, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 182-185; ISBN 978-4-88552-287-1
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2014,
Laakso I, Shimamoto T, Hirata A, Feliziani M
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 430-433; ISBN 978-4-88552-287-1
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2014,
Kang WG, Alexander Z, Jun HY, Park YH, Pack JK
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 198-201; ISBN 978-4-88552-287-1