-
2020,
Górski R, Kotwicka M, Skibińska I, Jendraszak M, Wosiński S
Ann Agric Environ Med 27 (3): 427-434
-
2020,
Adda S, Aureli T, Coltellacci S, D’elia S, Franci D, Grillo E, Pasquino N, Pavoncello S, Suman R, Vaccarono M
IEEE Access 8: 171956-171967
-
2020,
Magiera A, Solecka J
Rocz Panstw Zakl Hig 71 (3): 251-259
-
2020,
Lan Q, Zheng J, Chen J, Zhang M
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: pp. 270-275; ISBN 978-1-7281-7431-0
-
2020,
Hong S, Jeong S, Lee S, Sim B, Kim H, Kim J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: pp. 623-625; ISBN 978-1-7281-7431-0
-
2020,
Yang R, Zheng J, Song S, Guo R, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: pp. 261-265; ISBN 978-1-7281-7431-0
-
2020,
Yang X, Zheng J, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: pp. 266-269; ISBN 978-1-7281-7431-0
-
2020,
Rumeng T, Ying S, Tong W, Wentao Z
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: pp. 659-662; ISBN 978-1-7281-7431-0
-
2020,
Richter A, Ferková Z, Morava J
2020 ELEKTRO, Taormina, Italy. IEEE: pp. 1-6; ISBN 978-1-7281-7543-0
-
2020,
Halašová E, Tóthová B, Kmeťová Sivoňová M, Okajčeková T, Škovierová H, Špánik P, Pavelek M, Frivaldský M
2020 ELEKTRO, Taormina, Italy. IEEE: pp. 1-6; ISBN 978-1-7281-7543-0