The following terms were included:
"exposure assessment", Expositionsabschätzung, ばく露評価
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Sârbu A, Şorecău E, Şorecău M, Miclăuş S, Bechet P
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Iakovidis S, Apostolidis C, Manassas A, Samaras T
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2022 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: pp. 1-5; ISBN 978-1-6654-7018-6
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2022,
Galic M, Crnolatec M, Poljak D
2022 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: pp. 1-6; ISBN 978-1-6654-7018-6
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International Commission on the Biological Effects of Electromagnetic Fields (ICBE-EMF)
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2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: pp. 311-316; ISBN 978-1-6654-0789-2
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2022,
Adda S, Aureli T, Cassano T, Franci D, Migliore MD, Pasquino N, Pavoncello S, Schettino F, Schirone M
2022 IEEE International Symposium on Measurements & Networking (M&N), Padua, Italy. IEEE: pp. 1-6; ISBN 978-1-6654-8363-6
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2022,
Migliore MD, Franci D, Pavoncello S, Aureli T, Merli E, Lodovisi C, Chiaraviglio L, Schettino F
IEEE Access 10: 103438-103446
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2022,
Chiaraviglio L, Lodovisi C, Franci D, Grillo E, Pavoncello S, Aureli T, Blefari-Melazzi N, Alouini MS
IEEE Open J Commun Soc 3: 1592-1614
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2022,
Acri G, Anfuso C, Vermiglio G, Hartwig V
Electronics 11 (17): 2796
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2022,
Sârbu A, Migliore MD, Șorecău E, Șorecău M, Miclăuș S, Bechet P
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2022,
Bonato M, Tognola G, Benini M, Gallucci S, Chiaramello E, Fiocchi S, Parazzini M
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2022,
Chiaraviglio L, Lodovisi C, Franci D, Pavoncello S, Merli E, Aureli T, Blefari-Melazzi N, Migliore MD, Alouini MS
IEEE Open J Commun Soc 3: 1445-1465
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2022,
Capstick M, Mischa Sabathy, Brönnimann M, Rivara B, Bruno Klopott, Kühn S, Xi J, Choi D, Kuster N
2022 Wireless Power Week (WPW), Bordeaux, France. IEEE: pp. 68-71; ISBN 978-1-6654-8446-6
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2022 Wireless Power Week (WPW), Bordeaux, France. IEEE: pp. 64-67; ISBN 978-1-6654-8446-6
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2022,
Li N, Wang Y, Zhang J, Gan Z
2022 IEEE 5th International Electrical and Energy Conference (CIEEC), Nangjing, China. IEEE: pp. 3944-3948; ISBN 978-1-6654-1105-9