The following terms were included:
"elektromagnetische Verträglichkeit", EMC, EMV, "electromagnetic compatibility", 電磁両立性
-
2014,
Kim M, Kim S, Ahn S, Chun Y, Park S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 426-429; ISBN 978-4-88552-287-1
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2014,
Wiart J, Conil E, Varsier N, Sarrebourse T, Hadjem A, Martens L, Wermeeren G, Corre Y
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 635-637; ISBN 978-4-88552-287-1
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2014,
Shiina T, Suzuki Y, Kasai Y, Inami Y, Taki M, Wake K
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 166-169; ISBN 978-4-88552-287-1
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2014,
Chakarothai J, Suzuki Y, Taki M, Kojima M, Sasaki K, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 182-185; ISBN 978-4-88552-287-1
-
2014,
Cabot E, Zastrow E, Kuster N
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 237-240; ISBN 978-4-88552-287-1
-
2014,
Choi DG, Kim KH, Jang JD, Chung SY, Gimm YM
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 638-641; ISBN 978-4-88552-287-1
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2014,
Kim HS, Lee YH, Choi HD, Lee AK, Lee YS, Pack JK, Kim N, Ahn YH
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 170-173; ISBN 978-4-88552-287-1
-
2014,
Suzuki Y, Koike A, Takamura M, Taki M, Kojima M, Sasaki K, Chakarothai J, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 832-835; ISBN 978-4-88552-287-1
-
2014,
Neufeld E, Kuster N
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 230-233; ISBN 978-4-88552-287-1
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2014,
Laakso I, Shimamoto T, Hirata A, Feliziani M
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 430-433; ISBN 978-4-88552-287-1
