The following terms were included:
"elektromagnetische Verträglichkeit", EMC, EMV, "electromagnetic compatibility", 電磁両立性
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2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 745-748; ISBN 978-4-88552-287-1
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2014,
Diao YL, Sun WN, Chan KH, Leung SW, Siu YM
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 226-229; ISBN 978-4-88552-287-1
-
2014,
Laakso I, Hirata A, Fujiwara O
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 202-205; ISBN 978-4-88552-287-1
-
2014,
Sunohara T, Laakso I, Hirata A, Onishi T
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 449-452; ISBN 978-4-88552-287-1
-
2014,
Nagaoka T, Watanabe S, Niwa T
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 190-193; ISBN 978-4-88552-287-1
-
2014,
Sasaki K, Nagaoka T, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 537-540; ISBN 978-4-88552-287-1
-
2014,
Tateno A, Tanaka K, Nagaoka T, Watanabe S, Saito K, Takahashi M, Ito K
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 186-189; ISBN 978-4-88552-287-1
-
2014,
Kim M, Kim S, Ahn S, Chun Y, Park S
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 426-429; ISBN 978-4-88552-287-1
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2014,
Wiart J, Conil E, Varsier N, Sarrebourse T, Hadjem A, Martens L, Wermeeren G, Corre Y
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 635-637; ISBN 978-4-88552-287-1
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2014,
Shiina T, Suzuki Y, Kasai Y, Inami Y, Taki M, Wake K
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 166-169; ISBN 978-4-88552-287-1