The following terms were included:
"electromagnetic field", "Elektromagnetisches Feld", EMF, 電磁界
-
2006,
Lass J, Rodina A, Riipulk J, Hinrikus H, Bachmann T
2006 International Conference of the IEEE Engineering in Medicine and Biology Society, New York, NY, USA. IEEE: pp. 2924-2927; ISBN 978-1-4244-0032-4
-
2006,
Bachmann M, Lass J, Kalda J, Sakki M, Tomson R, Tuulik V, Hinrikus H
2006 International Conference of the IEEE Engineering in Medicine and Biology Society, New York, NY, USA. IEEE: pp. 1597-1600; ISBN 978-1-4244-0032-4
-
2006,
Sachse FB, Cole MJ, Stinstra JG
2006 International Conference of the IEEE Engineering in Medicine and Biology Society, New York, NY, USA. IEEE: pp. 2554-2557; ISBN 978-1-4244-0032-4
-
2006,
Cvetkovic D, Jovanov E, Cosic I
2006 International Conference of the IEEE Engineering in Medicine and Biology Society, New York, NY, USA. IEEE: pp. 3206-3209; ISBN 978-1-4244-0032-4
-
2006,
Cox FC, Sharma VK, Klibanov AM, Wu BI, Kong JA, Engels DW
2006 International Conference of the IEEE Engineering in Medicine and Biology Society, New York, NY, USA. IEEE: pp. 4340-4343; ISBN 978-1-4244-0032-4
-
2006,
Hartwig V, Giovannetti G, Vanello N, Costantino M, Landini L, Benassi A
2006 International Conference of the IEEE Engineering in Medicine and Biology Society, New York, NY, USA. IEEE: pp. 4127-4130; ISBN 978-1-4244-0032-4
-
Institute of Electrical and Electronics Engineers (IEEE),
IEEE Std C95.1-2005: 1-238, ISBN 978-0-7381-4835-9
-
2006,
Maby E, Le Bouquin Jeannes R, Faucon G
2006 International Conference of the IEEE Engineering in Medicine and Biology Society, New York, NY, USA. IEEE: pp. 3751-3754; ISBN 978-1-4244-0032-4
-
2006,
Jahns M, Durdle N, Lou E, Raso VJ
2006 International Conference of the IEEE Engineering in Medicine and Biology Society, New York, NY, USA. IEEE: pp. 3230-3233; ISBN 978-1-4244-0032-4
-
2006,
Nagaoka T, Togashi T, Saito K, Takahashi M, Ito K, Ueda T, Osada H, Ito H, Watanabe S
2006 International Conference of the IEEE Engineering in Medicine and Biology Society, New York, NY, USA. IEEE: pp. 5463-5467; ISBN 978-1-4244-0032-4