The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2014,
Kang WG, Alexander Z, Jun HY, Park YH, Pack JK
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 198-201; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 194-197; ISBN 978-4-88552-287-1
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2014,
Iwamoto T, Arima T, Uno T, Iwamoto T, Wake K, Fujii K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 529-532; ISBN 978-4-88552-287-1
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2014,
Shimizu HO, Shimizu K
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 162-165; ISBN 978-4-88552-287-1
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2014,
Higashiyama J, Tarusawa Y
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 650-653; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 625-628; ISBN 978-4-88552-287-1
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2014,
Miyaji Y, Shimada M, Mizuno Y, Naito K
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 621-624; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 206-209; ISBN 978-4-88552-287-1
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German Commission for Electrical, Electronic & Information Technologies of DIN and VDE (DKE),
DIN EN 61786-1 VDE 0848-786-1:2014-10
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2014,
Bieth F, Schunck T, Pinguet S, Delmote P
IEEE Trans Electromagn Compat 56 (4): 964-969