The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
-
2022,
Liu S, Onishi T, Taki M, Watanabe S
IEEE Trans Electromagn Compat 64 (4): 963-974
-
2022,
Gifuni A, Adil M, Grassini G, Buono A, Nunziata F, Micheli D, Migliaccio M
IEEE Trans Electromagn Compat 64 (4): 951-962
-
IEEE Trans Electromagn Compat 64 (4): 941-950
-
2022,
Xiao C, Hao S, Cheng D, Liao C
IEEE Trans Biomed Circuits Syst 16 (3): 372-383
-
2022,
Gryz K, Karpowicz J, Zradziński P
Sensors 22 (5): 1719
-
2022,
Shah IA, Basir A, Cho Y, Yoo H
IEEE Trans Electromagn Compat 64 (3): 640-649
-
2022,
Budnarowska M, Mizeraczyk J, Bisewski D
Prz Elektrotechniczny 98 (2): 110-113
-
2022,
Liu J, Wang Y, Guo R, Wang Q, Zheng J, Kurpad K, Kainz W, Chen J
IEEE Trans Electromagn Compat 64 (2): 286-294
-
2022,
Lan J, Diao Y, Duan X, Hirata A
IEEE Trans Electromagn Compat 64 (2): 551-558
-
2022,
Sassi O, Kadi M, Niederholz M
IEEE Trans Electromagn Compat 64 (1): 139-149
-
2022,
Narusue Y, Morikawa H
IEEE Trans Magn 58 (2): 1-5
-
Institute of Electrical and Electronics Engineers (IEEE),
IEEE Std 149-2021: 1-207, ISBN 978-1-5044-8017-8
-
2021,
EMF-Institut (Fachinstitut für Elektromagnetische Verträglichkeit zur Umwelt), Nießen P
1-28
-
2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Nusa Dua - Bali, Indonesia. IEEE: 1-4; ISBN 978-1-7281-7622-2
-
IEEE Trans Electromagn Compat 63 (1): 286-293
-
2021,
Kwon D, Lee YS, Lee AK, Choi HD
IEEE Trans Electromagn Compat 63 (2): 384-389
-
2021,
Ruddle AR, Martin AJM, Emery M
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 1-6; ISBN 978-1-6654-4889-5
-
2021,
Chan G, Lee CC, Wei Y, Tsang KF
2021 IEEE International Symposium on Product Compliance Engineering - Asia (ISPCE-ASIA), Taipei, Taiwan. IEEE: 01-06; ISBN 978-1-6654-4343-2
-
2021,
Yang C, Schierholz M, Trunczik E, Helmich LM, Brüns HD, Schuster C
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 697-702; ISBN 978-1-6654-4889-5
-
German Commission for Electrical, Electronic & Information Technologies of DIN and VDE (DKE),
DIN EN IEC 61980-1:2021-09 VDE 0122-10-1:2021-09
-
2021,
Das M, Vogt-Ardatjew R, Van den Berg B, Leferink F
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 857-861; ISBN 978-1-6654-4889-5
-
2021,
Song X, Li R, Yue Y, Wan S
2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Nusa Dua - Bali, Indonesia. IEEE: 1-4; ISBN 978-1-7281-7622-2
-
2021,
Adegbola R, Fifatin FX, Agbokpanzo R, Acakpovi A
2021 IEEE 8th International Conference on Adaptive Science and Technology (ICAST), Accra, Ghana. IEEE: 1-6; ISBN 978-1-6654-2718-0
-
2021,
Evangelista J, Loschi H, Costa ET, Smolenski R, Moonen N, Vogt-Ardatjew R
2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Nusa Dua - Bali, Indonesia. IEEE: 1-4; ISBN 978-1-7281-7622-2
-
2021,
Ardiatna W, Nugroho HW, Hidayat SW, Sukma I, Supono I, Mandaris D
2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Nusa Dua - Bali, Indonesia. IEEE: 1-4; ISBN 978-1-7281-7622-2