The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
-
2024,
Yao A, Pei Y, He J, Wang J, Yang P
IEEE Trans Electromagn Compat 66 (2): 405-416
-
2024,
Woo S, Shin Y, Lee C, Moon J, Kim H, Kim H, Huh S, Ahn S
IEEE Trans Electromagn Compat 66 (3): 1015-1028
-
2024,
Yao M, Pedersen GF, Zhang S
IEEE Trans Electromagn Compat 66 (3): 706-719
-
2024,
Vivarelli C, Censi F, Calcagnini G, Falsaperla R, Mattei E
Health Phys 127 (2): 269-275
-
2024,
Zhou C, Snyder DP, Epstein B, Robinson ZT, Jin GY, Tang PY, Polcawich RG, Roper M
IEEE Trans Electromagn Compat 66 (3): 720-727
-
Energies 17 (1): 126
-
2024,
Quercio M, Lozito GM, Corti F, Riganti Fulginei F, Laudani A
IEEE Access 12: 16728-16740
-
2024,
Sufian MA, Hussain N
IEEE Trans Electromagn Compat 66 (2): 417-426
-
2024,
Vivarelli C, Censi F, Calcagnini G, Freschi F, Giaccone L, Canova A, Mattei E
IEEE Trans Electromagn Compat 66 (1): 97-107
-
2024,
Xu Z, Rodriguez-Villegas E
IEEE Trans Biomed Circuits Syst 18 (2): 460-473
-
IEEE Trans Electromagn Compat 66 (2): 392-404
-
2024,
David A, Tiemann M, Haussmann N, Stroka S, Clemens M, Schmuelling B
IEEE Ind Appl Mag 30 (1): 59-67
-
2024,
Zhekov SS, Yao M, Di Paola C, Xu B, Zhang S
IEEE Trans Electromagn Compat 66 (1): 61-69
-
2024,
Ardeshirpour Y, Cohen ED, Seidman SJ, Taddese B, Zaidi T, Bassen H
Bioelectromagnetics 45 (2): 70-81
-
2024,
Kirawanich P, Dey P, Sumpavakup C
IEEE Trans Transp Electrif 10 (2): 4571-4582
-
2023,
Rhee J, Ahn J, Kim H, Lee C, Ahn S
2023 XXXVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS), Sapporo, Japan. IEEE: pp. 1-4; ISBN 9798350309973
-
2023,
Gutiérrez-Martínez J, Toledo-Peral CL, Vega-Martínez G, Mercado-Gutiérrez JA
2023 Global Medical Engineering Physics Exchanges/Pacific Health Care Engineering (GMEPE/PAHCE), Songdo, Korea, Republic of. IEEE: pp. 1-6; ISBN 9798350304015
-
2023,
Vélez RS, van Helvoort MJAM, Vogt-Ardatjew R, Van den Berg B, Leferink F
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: pp. 1-6; ISBN 9798350324013
-
2023,
Zhou X, Dou L, Huang H, Shen Q, Zhou X, Li A, Tang W, Pang X, Zhang Y, Wu T
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: pp. 1-5; ISBN 9798350333114
-
2023,
Xinhua P, Xin Z, Huixiong H, Qingfei S, Anxiang L, Wei T, Chao Y, Tong W
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: pp. 1-5; ISBN 9798350333114
-
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: pp. 1-4; ISBN 9798350333114
-
2023,
Li C, Sha S, Zhao H, Xing L, Xu Q
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: pp. 1-3; ISBN 9798350333114
-
Electronics 12 (23): 4780
-
2023,
Wu J, Ye J, Zou J, Gao J, Cui K
IEEE Access 11: 134191-134198
-
2023,
Giurgiuman A, Gliga M, Bojita A, Andreica S, Munteanu C, Topa V, Constantinescu C, Pacurar C
Technologies 11 (6): 159
-
2023,
Bastian GG, Pinto Nunes T, Quílez M, Fernández-Chimeno M, Silva F
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: pp. 1-6; ISBN 9798350324013
-
2023,
Karpowicz J, Gryz K, Zradziński P
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: pp. 1-5; ISBN 9798350324013
-
2023,
Voicu V, Dina LA, Dumbrava I, Mircea PM, Fieraru I
2023 International Conference on Electromechanical and Energy Systems (SIELMEN), Craiova, Romania. IEEE: pp. 1-6; ISBN 9798350315257
-
2023,
Vivarelli C, Censi F, Calcagnini G, Mattei E
2023 53rd European Microwave Conference (EuMC), Berlin, Germany. IEEE: pp. 263-266; ISBN 9798350347395
-
2023,
Nazemi M, Dommerque R, Daniel S
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: pp. 1-6; ISBN 9798350324013
-
2023,
Yamaguchi-Sekino S, Ikuyo M, Kamegai K, Taki M, Onishi T, Watanabe S
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: pp. 1-6; ISBN 9798350324013
-
2023,
Gryz K, Karpowicz J, Zradziński P
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: pp. 1-5; ISBN 9798350324013
-
2023,
Ramos V, Suárez SD, Marina P, Febles VM, Rabassa LE, Hernández JA
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: pp. 1-6; ISBN 9798350324013
-
2023,
Campi T, Cecilia V, Mattei E, Boumerdassi W, Rotellini M, Tatangelo G, Feliziani M
2023 XXXVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS), Sapporo, Japan. IEEE: pp. 1-4; ISBN 9798350309973
-
2023,
Parsa N, Sanphuang V
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: p. 655; ISBN 9798350309775
-
2023,
Boukabou I, Rupanetti D, Kaabouch N, Foust L
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: pp. 413-418; ISBN 9798350309775
-
2023,
Asadi R, Aliakbarian H, Sahraei A, Yazdani R, Kim DH
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: pp. 608-613; ISBN 9798350309775
-
2023,
Muramatsu D, Kodama M
AIP Adv 13 (8): 085022
-
2023,
Hwata C, Rushingabigwi G, Gatera O, Twizere C, Mukanyiligira D, Thomas BN
2023 Photonics & Electromagnetics Research Symposium (PIERS), Prague, Czech Republic. IEEE: pp. 1389-1396; ISBN 9798350312850
-
2023,
Kataja J, Nissi J, Roine T, Laakso I
IEEE Trans Electromagn Compat 65 (6): 1647-1655
-
2023,
Voicu V, Dina LA, Mircea PM, Dumbrava I
2023 Power Quality and Electromagnetic Compatibility at Low Frequency (PQEMC-LF), Craiova, Romania. IEEE: pp. 61-64; ISBN 9798350341348
-
2023,
Kuchina AP, Zakirova EA
2023 Systems of Signal Synchronization, Generating and Processing in Telecommunications (SYNCHROINFO), Pskov, Russian Federation. IEEE: pp. 1-4; ISBN 9798350348323
-
IEEE Trans Electromagn Compat 65 (5): 1282-1291
-
2023,
Souček T, Richter A, Morava J, Slavík L
2023 5th International Congress on Human-Computer Interaction, Optimization and Robotic Applications (HORA), Istanbul, Turkiye. IEEE: pp. 1-4; ISBN 9798350337532
-
2023,
Campi T, Cruciani S, Maradei F, Feliziani M
Energies 16 (9): 3822
-
2023,
Shikhantsov S, Thielens A, Vermeeren G, Demeester P, Martens L, Joseph W
IEEE Trans Electromagn Compat 65 (4): 960-971
-
IEEE Trans Electromagn Compat 65 (4): 1090-1097
-
2023,
Yao M, Zhekov SS, Xu B, Li K, Zhang S
IEEE Trans Electromagn Compat 65 (5): 1292-1299
-
2023,
Li Y, Ying Y, Xie K, Pan S
IEEE Trans Electromagn Compat 65 (3): 643-654
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2023,
Orlacchio R, Andrieu G, Joushomme A, Patrignoni L, Hurtier A, Poulletier de Gannes F, Lagroye I, Percherancier Y, Arnaud-Cormos D, Leveque P
IEEE Trans Electromagn Compat 65 (1): 39-50