The following terms were included:
"amplitude modulation", Amplitudenmodulation, AM, 振幅変調
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2024,
Ahlawat S, Kanaujia BK, Singh N, Zaidi AM, Rambabu K, Matekovits L
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2024,
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2024,
Imperio CG, Levin FR, Martinez D
Am J Psychiatry 181 (11): 958-972
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2024 International Conference on Electromagnetics in Advanced Applications (ICEAA), Lisbon, Portugal. IEEE: pp. 458-463; ISBN 9798350360981
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Wansbrough K, Marinovic W, Fujiyama H, Vallence AM
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2024,
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2024,
Shamsul Kamal AM, Mohd Isa FN, Abdul Malekl NF, Mohamad SY
2024 IEEE International Symposium on Antennas and Propagation and INC/USNC‐URSI Radio Science Meeting (AP-S/INC-USNC-URSI), Firenze, Italy. IEEE: pp. 2711-2712; ISBN 9798350369915
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2024 IEEE International Symposium on Antennas and Propagation and INC/USNC‐URSI Radio Science Meeting (AP-S/INC-USNC-URSI), Firenze, Italy. IEEE: pp. 2461-2462; ISBN 9798350369915
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2024,
Birkefeld K, Seifert D, Heinemann A, Ondruschka B
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2024,
Competence Centre Electromagnetic Fields (KEMF)
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2024,
Bender SA, Green DB, Kilgore KL, Bhadra N, Ardell JL, Vrabec TL
2024 American Control Conference (ACC), Toronto, ON, Canada. IEEE: pp. 4536-4541; ISBN 9798350382662
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2024,
DePamphilis GM, Tirrell E, Kronenberg EF, Brown JC, Fukuda AM, Carpenter LL
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IEEE Trans Antennas Propag 72 (11): 8239-8250
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2024,
Arulmurugan S, Kumar TRS, Sidén J, Alex ZC
IEEE Open Journal of Antennas and Propagation 5 (6): 1805-1814
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2024,
Li H, Yu K, Xue P, Xiang J, Wu J
Am J Transl Res 16 (8): 3572-3581
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2024,
Adda S, Bottura V, D'Elia S, Pasquino N, Suman R, Vaccarono M
IEEE Trans Instrum Meas 73: 1-9, article ID 5504109
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2024,
Rathebe PC, Matjutla N, Ndwandwe V, Mafa T
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2024,
Lewis CP, Nakonezny PA, Sonmez AI, Ozger C, Garzon JF, Camsari DD, Yuruk D, Romanowicz M, Shekunov J, Zaccariello MJ, Vande Voort JL, Croarkin PE
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2024,
Sofri T, Andrew AM, Rahim HA, Nishizaki H, Kamarudin LM, Wong PW, Soh PJ
Prz Elektrotechniczny 100 (6): 122-128
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2024,
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2024,
Noor SK, Osman MN, Yasin MNM, Ismail AM, Islam T, Ramli N
2024 IEEE Symposium on Wireless Technology & Applications (ISWTA), Kuala Lumpur, Malaysia. IEEE: pp. 167-172; ISBN 9798350351361
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2024,
Karipidis K, Baaken D, Loney T, Blettner M, Brzozek C, Elwood M, Narh C, Orsini N, Röösli M, Paulo MS, Lagorio S
Environ Int 191: 108983