-
2020,
Górski R, Kotwicka M, Skibińska I, Jendraszak M, Wosiński S
Ann Agric Environ Med 27 (3): 427-434
-
2020,
Adda S, Aureli T, Coltellacci S, D’elia S, Franci D, Grillo E, Pasquino N, Pavoncello S, Suman R, Vaccarono M
IEEE Access 8: 171956-171967
-
2020,
Mahanta D, Bordoloi H, Saikia SJ
2020 International Conference on Computational Performance Evaluation (ComPE), Shillong, India. IEEE: pp. 632-636; ISBN 978-1-7281-6645-2
-
2020,
Tariq RU, Ye M, Cao Z, He Y
2020 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), Suzhou, China. IEEE: pp. 1-3; ISBN 978-1-7281-6065-8
-
2020,
Gao P, Chen Q, Hu J, Lin Y, Lin J, Guo Q, Yue H, Zhou Y, Zeng L, Li J, Ding G, Guo G
Mol Med Rep 22 (4): 2775-2782
-
2020,
Oh JY, Lee YJ, Kim EH
Technol Cancer Res Treat 19: 1533033820947481
-
2020,
Magiera A, Solecka J
Rocz Panstw Zakl Hig 71 (3): 251-259
-
2020,
Eggert T, Dorn H, Sauter C, Schmid G, Danker-Hopfe H
Environ Res 191: 110173
-
2020,
Lan Q, Zheng J, Chen J, Zhang M
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: pp. 270-275; ISBN 978-1-7281-7431-0
-
2020,
Hong S, Jeong S, Lee S, Sim B, Kim H, Kim J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: pp. 623-625; ISBN 978-1-7281-7431-0
-
2020,
Rumeng T, Ying S, Tong W, Wentao Z
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: pp. 659-662; ISBN 978-1-7281-7431-0
-
2020,
Halašová E, Tóthová B, Kmeťová Sivoňová M, Okajčeková T, Škovierová H, Špánik P, Pavelek M, Frivaldský M
2020 ELEKTRO, Taormina, Italy. IEEE: pp. 1-6; ISBN 978-1-7281-7543-0
-
2020,
Zuo H, Liu X, Li Y, Wang D, Hao Y, Yu C, Xu X, Peng R, Song T
J Chem Neuroanat 109: 101857
-
2020,
Sarraf M, Kataria S, Taimourya H, Santos LO, Menegatti RD, Jain M, Ihtisham M, Liu S
Plants 9 (9): E1139
-
2020,
Bian ZX, Wang JF, Ma H, Wang SM, Luo L, Wang SM
J Food Sci Technol 57 (10): 3913-3919
-
2020,
Jia Y, Shrestha N, Wang X, Wang T, Luo F
J Pain Res 13: 2093-2102
-
2020,
Suh DH, Hong ES, Kim HJ, Lee SJ, Kim HS
Dermatol Ther 33 (6): e14284
-
2020,
Muntianu PI, Breinbjerg O
IEEE Antennas Wirel Propag Lett 19 (9): 1467-1470
-
2020,
Bouisset N, Villard S, Legros A
IEEE Access 8: 165387-165395
-
2020,
Pinto R, Sambucci M, Laudisi F, Nasta F, Lodato R, Altavista P, Lovisolo GA, Marino C, Pioli C
Environ Res 191: 110138
-
2020,
Borzoueisileh S, Shabestani Monfared A, Ghorbani H, Mortazavi SMJ, Zabihi E, Pouramir M, Doustimotlagh AH, Shafiee M, Niksirat F
Caspian J Intern Med 11 (3): 315-323
-
2020,
Iyyanki M, Jayanthi P, Singh D, Tumula S, Megham P
2020 International Conference on Communication and Signal Processing (ICCSP), Chennai, India. IEEE: pp. 1250-1255; ISBN 978-1-7281-4989-9
-
2020,
Jothi Chitra R, Nagarajan V, Mukesh D
2020 International Conference on Communication and Signal Processing (ICCSP), Chennai, India. IEEE: pp. 1638-1642; ISBN 978-1-7281-4989-9
-
IEEE Transactions on Vehicular Technology 69 (10): 11841-11856
-
2020,
Javan-Khoshkholgh A, Farajidavar A
2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Montreal, QC, Canada. IEEE: pp. 4217-4220; ISBN 978-1-7281-1991-5
