-
2020,
Mahaki H, Jabarivasal N, Sardanian K, Zamani A
Int J Occup Environ Med 11 (1): 24-32
-
2020,
Huang L, Chen C, Li Z, Zhang Y, Zhang H, Lu J, Ruan S, Zeng Y
Nanotechnology 31 (16): 162001
-
2020,
Smith-Roe SL, Wyde ME, Stout MD, Winters JW, Hobbs CA, Shepard KG, Green AS, Kissling GE, Shockley KR, Tice RR, Bucher JR, Witt KL
Environ Mol Mutagen 61 (2): 276-290
-
2020,
Xia Z, Li H, Lee Z, Xiao S, Shao W, Ding X, Yang X
IEEE Trans Antennas Propag 68 (3): 2399-2404
-
2020,
Seo S, Jo H, Bien F
IEEE Transactions on Power Electronics 35 (5): 4518-4532
-
2020,
Zada M, Shah IA, Yoo H
IEEE Trans Antennas Propag 68 (2): 1140-1144
-
2020,
An MK, Hong EH, Suh SB, Park EJ, Kim KH
Dermatol Surg 46 (6): 796-802
-
J Back Musculoskelet Rehabil 33 (3): 523-528
-
2020,
Sher I, Tzameret A, Goldberg Z, Bubis E, Avni-Zauberman N, Kalter-Leibovici O, Marcovich AL, Ben Simon G, Rotenstreich Y
Ocul Surf 18 (1): 64-73
-
2020,
Abdel-Rahman KA, Elawamy AM, Mostafa MF, Hasan WS, Herdan R, Osman NM, Ibrahim AS, Aly MG, Ali AS, Abodahab GM
Eur J Pain 24 (2): 338-345
-
2020,
Vigneri S, Sindaco G, La Grua M, Zanella M, Lo Bianco G, Paci V, Vinci FM, Sciacca C, Ravaioli L, Pari G
Clin J Pain 36 (1): 25-33
-
2020,
Alzayed KA, Alsaadi SM
Asian Spine J 14 (1): 33-42
-
2020,
Maruyama Y, Kamata H, Watanabe S, Kita R, Shinyashiki N, Yagihara S
Skin Res Technol 26 (2): 255-262
-
2020,
Alipour A, Meyer ES, Dumoulin C, Watkins R, Elahi H, Loew W, Schweitzer J, Olson G, Chen Y, Tau S, Guttman M, Kolandaivelu A, Halperin H, Schmidt E
IEEE Trans Biomed Eng 67 (6): 1616-1627
-
2020,
De Lellis P, Lo Iudice F, Pasquino N
IEEE Trans Instrum Meas 69 (6): 3198-3205
-
2020,
Yu G, Tang Z, Chen H, Chen Z, Wang L, Cao H, Wang G, Xing J, Shen H, Cheng Q, Li D, Wang G, Xiang Y, Guan Y, Zhu Y, Liu Z, Bai Z
Sci Total Environ 698: 133860
-
2020,
Hong JY, Kwon TR, Kim JH, Lee BC, Kim BJ
J Cosmet Dermatol 19 (5): 1105-1109
-
2020,
Rodrigues RM, Avelar Z, Vicente AA, Petersen SB, Pereira RN
Food Chem 304: 125442
-
2020,
Daskalakis ZJ, Dimitrova J, McClintock SM, Sun Y, Voineskos D, Rajji TK, Goldbloom DS, Wong AHC, Knyahnytska Y, Mulsant BH, Downar J, Fitzgerald PB, Blumberger DM
Neuropsychopharmacology 45 (2): 276-282
-
IEEE J Electromagn RF Microw Med Biol 4 (3): 157-163
-
2020,
Liorni I, Lisewski T, Capstick MH, Kuehn S, Neufeld E, Kuster N
IEEE Trans Electromagn Compat 62 (4): 1323-1332
-
Turksen K (ed.): Cell Biology and Translational Medicine, Volume 7. Advances in Experimental Medicine and Biology, volume 1237; Springer, New York; pp. 135-149; ISBN 978-3-030-37844-8
-
2020,
Rumpf JJ, May L, Fricke C, Classen J, Hartwigsen G
Cereb Cortex 30 (3): 1030-1039
-
2020,
Szelenberger R, Kostka J, Saluk-Bijak J, Miller E
Curr Neuropharmacol 18 (1): 51-64
-
2020,
Garcia-Sanchez T, Mercadal B, Polrot M, Muscat A, Sarnago H, Lucia O, Mir LM
IEEE Trans Biomed Eng 67 (4): 1040-1049
-
2020,
Sinha P, Sarkar B, Goswami S, Ray Karmakar P, Dasgupta SR, Basu S
Pain Pract 20 (1): 16-23
-
2020,
Zheng J, Lan Q, Zhang X, Kainz W, Chen J
IEEE Trans Electromagn Compat 62 (3): 673-681
-
2020,
Noites A, Vale AL, Pereira AS, Morais A, Vilarinho R, Carvalho P, Amorim M, Moreira T, Mendonça A
J Cosmet Dermatol 19 (3): 638-645
-
2020,
Vale AL, Pereira AS, Morais A, de Carvalho P, Vilarinho R, Mendonça A, Noites A
J Cosmet Dermatol 19 (2): 359-367
-
2020,
Tatlıparmak A, Aksoy B, Shishehgarkhaneh LR, Gökdemir G, Koç E
J Cosmet Dermatol 19 (1): 115-121
-
2020,
Jamshed MA, Heliot F, Brown T
IEEE J Electromagn RF Microw Med Biol 4 (1): 24 - 36
-
2020,
Romeo S, Sannino A, Zeni O, Angrisani L, Massa R, Scarfi MR
IEEE J Electromagn RF Microw Med Biol 4 (1): 17-23
-
2020,
Boehmert C, Freudenstein F, Wiedemann P
J Risk Res 23 (5): 571-597
-
2020,
Wen X, Li Y, Hamblin MR
Dermatol Surg 46 (1): 148-150
-
StatPearls
-
2020,
Mailan Arachchige Don RK, Jung JS, Lee YJ, Hong SC
Int J Occup Saf Ergon 26 (3): 624-631
-
2020,
Gerke M, de Ridder M, Mehnert C, Vogel E, Hoffmann M, Kurz T
State Office for the Environment of the Federal State of Baden-Württemberg (LUBW), Bavarian State Office for the Environment (LfU),
4. aktualisierte Auflage: 1-140
-
2019,
Chow JPW, Chung HSH, Chan LLH, Shen R, Tang SC
IEEE Transactions on Power Electronics 34 (10): 9779-9793
-
2019,
Poljak D, Šušnjara A, Dorić V, Šesnić S, Cvetković M, Dodig H
2019 23rd International Conference on Applied Electromagnetics and Communications (ICECOM), Dubrovnik, Croatia. IEEE: pp. 1-6; ISBN 978-1-7281-5515-9
-
2019,
Araneo R, Dehghanian P, Mitolo M
IEEE Trans Ind Appl 55 (6): 5613-5620
-
2019,
Seward WG, Huxtable RD, Beynon BP, Zvirblys A, Camacho-Hunt NJ, Albano M, Cipcigan LM
2019 54th International Universities Power Engineering Conference (UPEC), Bucharest, Romania. IEEE: pp. 1-6; ISBN 978-1-7281-3350-8
-
2019,
Lee CS, Bai B, Song QR, Wang ZQ, Li GF
IEEE Trans Microw Theory Tech 67 (12): 5417-5428
-
2019,
Bardati F, Di Carlofelice A, Tognolatti P
2019 PhotonIcs & Electromagnetics Research Symposium - Spring (PIERS-Spring), Rome, Italy. IEEE: pp. 2538-2546; ISBN 978-1-7281-3404-8
-
Federal Office for Radiation Protection (BfS),
Ressortforschungsberichte zum Strahlenschutz, BfS-RESFOR-155/19: 1-122
-
2019,
Raj AB, Nesasudha M
2019 2nd International Conference on Signal Processing and Communication (ICSPC), Coimbatore, India. IEEE: pp. 193-197; ISBN 978-1-7281-1850-5
-
2019,
Wu I, Matsumoto Y, Gotoh K, Wake K, Watanabe S
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: pp. 169-172; ISBN 978-1-7281-0595-6
-
2019,
Rahman AA, Kamardin K, Yamada Y
2019 IEEE Asia-Pacific Conference on Applied Electromagnetics (APACE), Melacca, Malaysia. IEEE: pp. 1-5; ISBN 978-1-7281-2163-5
-
2019,
Iqbal A, Basir A, Smida A, Mallat NK, Elfergani I, Rodriguez J, Kim S
IEEE Access 7: 111135-111144
-
Handbook of Biological Effects of Electromagnetic Fields, volume 1, 4th edition; Greenebaum B, Barnes F (eds.): CRC Press, Boca Raton, FL; ISBN 978-1-138-73526-2
-
2019,
Giman FN, Jack Soh P, Al-Hadi AA, Jamlos MF, Lago H, Schreurs D, Abdul Rahim SK, Beyer A
2019 International Applied Computational Electromagnetics Society Symposium (ACES), Miami, FL, USA. IEEE: pp. 1-2; ISBN 978-1-7281-1518-4