The following terms were included:
"Institute of Electrical and Electronics Engineers", IEEE, 米国電気電子学会
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2008,
Bahillo A, Blas J, Fernandez P, Mazuelas S, Vinuela A, Lorenzo RM, Abril EJ
2008 30th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Vancouver, BC, Canada. IEEE: pp. 2821-2824; ISBN 978-1-4244-1814-5
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2008,
Beyer C, Jelezarov I, Fröhlich J
2008 30th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Vancouver, BC, Canada. IEEE: pp. 939-942; ISBN 978-1-4244-1814-5
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2008,
Duyan G, Xu G, Yu H, Yang S, Yang Q, Yan W
2008 30th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Vancouver, BC, Canada. IEEE: pp. 1331-1334; ISBN 978-1-4244-1814-5
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2008,
Nagaoka T, Saito K, Takahashi M, Ito K, Watanabe S
2008 30th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Vancouver, BC, Canada. IEEE: pp. 2817-2820; ISBN 978-1-4244-1814-5
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2008,
Tange Y, Kanai Y, Saitoh Y
2008 30th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Vancouver, BC, Canada. IEEE: pp. 4368-4371; ISBN 978-1-4244-1814-5
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2008,
Mattei E, Calcagnini G, Censi F, Triventi M, Bartolini P
2008 30th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Vancouver, BC, Canada. IEEE: pp. 4387-4390; ISBN 978-1-4244-1814-5
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2008,
Kim DW, Lee JH, Ji HC, Kim SC, Nam KC, Cha EJ
2008 30th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Vancouver, BC, Canada. IEEE: pp. 2322-2325; ISBN 978-1-4244-1814-5
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2008,
Calcagnini G, Censi F, Triventi M, Mattei E, Losterzo R, Marchetta E, Bartolini P
2008 30th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Vancouver, BC, Canada. IEEE: pp. 4503-4506; ISBN 978-1-4244-1814-5
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2008,
Perentos N, Croft RJ, McKenzie RJ, Cvetkovic D, Cosic I
2008 30th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Vancouver, BC, Canada. IEEE: pp. 5680-5683; ISBN 978-1-4244-1814-5
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2008,
Wang J, Fujiwara O, Wake K, Watanabe S
IEEE Microw Wirel Compon Lett 18 (4): 260-262