The following terms were included:
"Digital Advanced Mobile Phone System", D-AMPS, デジタル先進携帯電話システム(D-AMPS)
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2023,
Sun L, Wang F, Han J, Bai L, Du J
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2022,
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2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), Guangzhou, China. IEEE: pp. 1-3; ISBN 978-1-6654-7835-9
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2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), Guangzhou, China. IEEE: pp. 1-3; ISBN 978-1-6654-7835-9
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2022,
Wu R, Zhang X, Pan W, Liu L, Dong J
2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), Guangzhou, China. IEEE: pp. 1-3; ISBN 978-1-6654-7835-9
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2022,
Xiao J, Cao BY, Xie Z, Ji YX, Zhao XL, Yang HJ, Zhuang W, Sun HH, Liang WM
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2022,
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2022 3rd URSI Atlantic and Asia Pacific Radio Science Meeting (AT-AP-RASC), Gran Canaria, Spain. IEEE: pp. 1-3; ISBN 978-1-6654-9986-6
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2022,
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2022,
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2022,
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2022 IEEE 11th International Conference on Communication Systems and Network Technologies (CSNT), Indore, India. IEEE: pp. 72-75; ISBN 978-1-6654-8039-0
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IEEE Access 10: 60946-60954
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2022,
Amaria S, Keltouma N, Turkiya A
2022 7th International Conference on Image and Signal Processing and their Applications (ISPA), Mostaganem, Algeria. IEEE: pp. 1-4; ISBN 978-1-6654-8043-7
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2022,
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IEEE Access 10: 54563-54571
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2022,
Serrano-Díaz DG, Trujillo-Romero CJ, Vera A, Leija L
2022 Global Medical Engineering Physics Exchanges/ Pan American Health Care Exchanges (GMEPE/PAHCE), Panama City, Panama. IEEE: pp. 1-6; ISBN 978-1-6654-8436-7
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2022,
Hao Y, Li W, Wang H, Zhang J, Wang H, Dong J, Yao B, Xu X, Zhao L, Peng R
Biosci Rep 42 (4): BSR20212584
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2022,
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IEEE Trans Ind Electron 69 (10): 10045-10054
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2022,
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IEEE J Electromagn RF Microw Med Biol 6 (1): 52-60
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2022,
Park HJ, Choi JH, Nam MH, Seo YK
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2022,
Wali SQ, Sali A, Allami JK, Osman AF
IEEE Access 10: 9048-9058
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2022,
Prantner M, Parspour N, Haen SP, Böckeler M, Hetzel J
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2022,
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2022,
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López OLA, Alves H, Montejo-Sánchez S, Souza RD, Latva-aho M
IEEE Internet Things J 9 (10): 7375-7387