By:
Boyer A, Duffau H, Vincent M, Ramdani S, Mandonnet E, Guiraud D, Bonnetblanc F
Published in: 2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Honolulu, HI, USA. IEEE, 2018: pp. 2210-2213; ISBN 978-1-5386-3647-3